OCV (On chip Variation)

Fabrication process imperfections could creep up into the wafer at any point of time during the silicon development process. The variation in the dimensions of the transistors in the design could lead to major changes in the characteristic parameters that are responsible for maintaining the speed of the cell. Length, width variations due to process imperfections could yield variations in threshold voltage of the devices in the same wafer, die or even the same chip. As such the device to be built needs to satisfy the criteria of being able to operate even under any minute mishaps. This is where on-chip variation or OCV comes into picture.